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NA 2010: Secure shipments without void fill

March 01, 2010

NA 2010, slated for April 26-29, will showcase more than 500 exhibits and include a comprehensive educational conference. The event, held at the I-X Center in Cleveland, will offer an array of products to help improve productivity at your company.

The patent-pending, all-paper pack packaging system eliminates void fill, replacing it with a cohesive paper that secures the product in place within the package. The system also includes a self-sealing box made of corrugated composite board and 100% recycled paper. The packaging does not require processing equipment, tape or void-fill, making it ideal for retail and industrial channels.

Smart Karton, 636-724-8181, http://www.smartkarton.com, Booth 1226.

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Article Topics

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