Pack Expo: Siemens showcases design simulation and cloud-based optimization solutions

At Pack Expo International in early November, Siemens highlighted solutions designed to remove risk and cost from mechatronics design and maintenance.

The Mechatronics Concept Designer (MCD) allows users to create simulations of machinery before it is finalized and built. Controlled by the PLC and software as though connected to a real-world machine, the software enables visualization and multi-disciplinary collaboration.

“For new equipment, typically you create a CAD design, build the machine, program it, and then test it,” said Ajay Rana, business developer, packaging, for Siemens. “If you have a PLC and this software you can now test before $1 million is locked up in a machine.”

Once the machine is in service, Siemens’ MindSphere cloud-based platform extracts relevant data from the PLC to enable proactive maintenance and parts management. The open platform allows customers and developers to develop, extend, and operate applications in the cloud, such as the online monitoring of globally distributed machine tools, industrial robots, or industrial equipment like compressors and pumps.

“PLC data might be used for production planning, but not for maintenance planning, although the data is very valuable for that purpose,” Rana said. “The PLC knows how long a motor has been on, or how many cycles a gripper has gone through, so it can send an alert when a component is at 95% of its life. Instead of carrying a lot of parts inventory and then rushing to make repairs, parts can be ordered proactively.”

Rana said he anticipates a future where solution providers will sell output, not the machine that creates the output. “How do you ensure that output?” he asked. “Only when you have the data and use it.”

Siemens also launched several new products:
● Version 14 (V14) of its’ Totally Integrated Automation (TIA) Portal which shortens the time to market for machine manufacturers and increases end user productivity. TIA now includes cloud-based engineering where users can access the ‘plant controller’ from their private cloud with the new TIA Portal Cloud Connector. Cloud-based engineering can also be accessed through MindSphere, the Siemens cloud solution for industry, for additional digital services from Siemens.

● The Multi-Carrier-System from Siemens and Festo delivers flexible, Industry 4.0-ready intralogistics. The configurable transport system delivers flexibility and can be easily incorporated into existing processing and packaging environments. The MCS is intended to address the need for flexibility driven by increasingly complex product diversity, shorter product life cycles and growing levels of mass customization.

In this configurable transport system, the transport carriages, which are driven by linear motors, are flexibly moved to the individual units, e.g. filling, closing or labeling unit. The system moves freely and synchronously to the process and can be integrated in the existing intralogistics, including seamless loading and unloading of the carriages. The modular concept allows a quick conversion of the machine to different formats, other product types or seasonal requirements.

● New Siemens industrial flat panels include new 22” display and support arm options. Several mounting options available for the new Simatic 22” IFP2200 PRO and 19” IFP1900 PRO industrial flat panel monitors, which both feature widescreen, capacitive multi-touch glass fronts and IP65 degrees of protection.