NA 2010: Secure shipments without void fill

image
By Modern Materials Handling Staff
March 01, 2010 - MMH Editorial

NA 2010, slated for April 26-29, will showcase more than 500 exhibits and include a comprehensive educational conference. The event, held at the I-X Center in Cleveland, will offer an array of products to help improve productivity at your company.

The patent-pending, all-paper pack packaging system eliminates void fill, replacing it with a cohesive paper that secures the product in place within the package. The system also includes a self-sealing box made of corrugated composite board and 100% recycled paper. The packaging does not require processing equipment, tape or void-fill, making it ideal for retail and industrial channels.

Smart Karton, 636-724-8181, http://www.smartkarton.com Booth, 1226.



Subscribe to Modern Materials Handling magazine

Subscribe today. It's FREE!
Find out what the world's most innovative companies are doing to improve productivity in their plants and distribution centers.
Start your FREE subscription today!

Recent Entries

Opened today, the new office, located in Waterloo, Ontario, Canada, will address customers’ needs to further innovate the supply chain, effectively improving order accuracy and timeliness to consumers.

IHS Technology reports 2.1% fall in revenues for programmable logic controllers; strong growth in US and food and beverage.

Razat Gaurav to lead global industries and solutions; Enrique Rodriguez appointed global sales leader.

Hosted by the Reusable Packaging Association, education forum features more than a dozen sessions over three days.

Patent covers automatic method of sensing, recording and reporting vehicle impacts.

Article Topics

News · Packaging · NA 2010 · Smart Karton · All topics

Comments

Post a comment
Commenting is not available in this channel entry.


© Copyright 2013 Peerless Media LLC, a division of EH Publishing, Inc • 111 Speen Street, Ste 200, Framingham, MA 01701 USA