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Alexandra Slagle receives 2015 Richard C. Ryan Packaging Education Scholarship

Memorial scholarship recognized student's "understanding, passion, and international perspective."


Alexandra Slagle, a student at Michigan State University, is the recipient of the 2015 Richard C. Ryan Packaging Education Scholarship, funded by Dorner Mfg. Corp.

This scholarship, awarded to a student enrolled in a two- or four-year program at any of PMMI’s partner schools, was established in honor of Richard Ryan, the former president and CEO of Dorner, who passed away suddenly in September 2012. Ryan was a member of the PMMI Board of Directors and encouraged lifelong learning. His commitment to education inspired the creation of this memorial scholarship. In its third year, the scholarship is awarded to a student who presents merit in GPA, faculty recommendation and commitment to excellence within the packaging industry.

“This was a difficult decision because of the quality of all of our applicants, but we’re pleased to have selected Alexandra Slagle as the recipient of the Richard C. Ryan Scholarship for 2015,” said Jim Barwick, director of human resources, Dorner Mfg. “She has a clear understanding of the field, has a plan, shows passion, and we were particularly impressed by her international perspective.”

Alexandra, who will be a junior this fall at MSU, is majoring in packaging. She’s on the Dean’s List with a 3.87 GPA, and is expecting to graduate in May 2017. Alexandra said she hopes a career in packaging will ultimately improve the lives of others.

“I knew that I was looking for a career that was more than a future paycheck. I was looking for an opportunity to improve peoples’ daily lives and give back to the community. Packaging is just that,” she wrote in her scholarship application essay. “Packaging has allowed me to study what I love, while providing the opportunity to create practical solutions to increase the quality of life for others.”

Students applying for the scholarship must meet the following criteria:
● Have a GPA of 3.0 or higher
● Be enrolled in either a two- or four-year school and pursuing an undergraduate degree
● Be majoring in packaging engineering or a related area
● Demonstrate a commitment to excellence in the packaging area
● Be currently enrolled and attending a PMMI partnering school
● Demonstrate extra-curricular involvement, such as athletics
● Have a recommendation from faculty
● Have a financial need


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