Innovation Stage to return to Pack Expo in November

The Innovation Stage at PACK EXPO International and Pharma EXPO 2016 (Nov. 6–9; McCormick Place, Chicago) is shaping up to be the largest and most robust on-floor education feature since its inception in 2012, according to show producer PMMI, The Association for Packaging and Processing Technologies.

On the PACK EXPO International side, three stages, located in the Grand Concourse, will bring together industry leaders and subject matter experts for free educational programming addressing the most top-of-mind issues and trends. Sessions will address topics including:

• Internet of Things

• Machinery safety

• Standards & technology to improve productivity

• Sustainability

• Flexible manufacturing systems

• Smart packaging

• Contract packaging

• Global packaging trends

• Digital print technology

• Multipack solutions

• Ultrasonic technology

Pharma EXPO will host an additional Innovation Stage in the West Lobby addressing innovations including blister packaging solutions, thin film flexible packaging, photostability testing and protective packaging and serialization solutions.

To date, 59 sessions are confirmed, all 30-minutes in length. All sessions are free to attend. Check the schedule for full details. The full session schedule will also be accessible through the PACK EXPO International/Pharma EXPO mobile app.

“We know that our attendees have a lot to accomplish while at PACK EXPO and Pharma EXPO. With that in mind, the importance of offering valuable education on the show floor is a priority,” says Charles D. Yuska, president and CEO, PMMI. “The PACK EXPO and Pharma EXPO Innovation Stages give attendees access to an unparalleled range of processing and packaging education and innovations, conveniently located in close proximity to the exhibits.”